TP-Link, a global manufacturer of networking devices, has announced its two latest smartphones – Neffos X1 and Neffos X1 Max, at IFA 2016.
Both the devices feature an all-metal casing and comes with a 2.5D glass edge, in addition to gorilla glass protection and fingerprint unlocking.
TP-Link unveiled its latest Neffos series smartphones at IFA 2016 in Berlin
To delve into more details, the X1 Max sports a 5.5” 1080P IPS LCD screen, 3GB/4GB of RAM, 32GB/64GB internal storage, and 3,000 mAh battery. As for X1, it comes with a 5” 720P IPS LCD screen, 2GB/3GB RAM, 16GB/32GB storage, and 2,250 mAh battery.
Additionally, they are equipped with octa-core Helio P10 chipset, microSD card expansion (up to 128GB), and 13 MP rear and 5 MP front camera. Both the devices run on Android 6.9 Marshmallow.
TP-Link entered the smartphone market earlier this year with the launch of its new Neffos brand. The Neffos C5L, C5, and C5 Max were the models that debuted in the already crowded and competitive mid-tier segment.
At a press conference in Berlin on Thursday, Jeffrey Chao, co-founder and Chairman of TP-Link, underlined that the Shenzhen-based company has evolved to become much more than a networking company over the past two decades and that it constantly strives to meet the changing demands of customers.
“The Neffos smartphones demonstrate our determination to go beyond wireless technology and make life smarter and easier for today’s connected customers with innovative products and user-centric experiences,” Chao said.
The Neffos X series is the third smartphone series in the Neffos product line up.The Neffos X1 has been priced at EUR 199 while the Neffos X1 Max has been priced at EUR 249. The new devices will hit store shelves by October, this year.